MNI's ProStop Fuse

  • Manufacturing Networks, Inc., (MNI) a Silicon Valley Technology Firm has Developed a Breakthrough Fuse Design and a Low-Cost Method of Unencapsulated Packaging.
  • This Design Eliminates End Caps Used for SMT Assembly.
  • MNI has secured two Patents, and a Third Patent is in Process.

Breakthrough Fuse Design

Industry's First Fuse Using Wetting and Dewetting Forces. The principle of operation of MNI's Fuse is fundamentally different from traditional fuses.

Solder Ball Before Fusing Action

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After Fusing Action

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Industry's First PACKAGE LESS Fuse

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Game Changing Invention!

Chip Scale Packaging. Can be Made in 8 in Silicon Wafers to Lower Cost!

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INTEGRATABLE

World's Only Fuse That Can be Integrated with a Control IC on the Same Substrate (Silicon)

Control IC without the Fuse

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Control IC with the Fuse

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Fuse Integration:

  • Fuse area left blank to be processed last
  • Fuse metallization and solder bridge are
  • processed with standard MNI fuse process.

Wetting and Dewetting Forces Ensure a Gap That is Free of Debris After Fusing Action

Before Activation

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After Activation

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MNI's Fuse can be configured to protect against:

  • Over Current: These Fuse Designs are Customizable to Specified Current Values
  • Over Temperature: Protection is Inherently Achieved Based on the Solder Alloy Kinetics:

Advantages of ProStop Fuses

  • Once the Fuse opens due to an over current condition the physical gap is clean. there is no potential leakage due to strands of metal connection as is possible in competitor's Fuses.
  • The Size of the ProStop can be much smaller and lower profile (thinner) than the size of an equivalent thin film surface mount fuse made using current technology.
  • The Over Current Fuse is automatically an Over Temperature Fuse as the Fuse material (Solder) melts and opens at a given temperature.
  • The ProStop Fuse does not need any encapsulant overpacking.
  • These Fuse designs do not utilize solder End Cap terminations normally needed for SMT. This presents significant cost benefits.
  • The ProStop Fuse can be made as small as the market can handle in assembly: MNI has made the World's smallest Fuse: 01005 size 0.4mm x 0.2mm x 0.12mm that can carry >1A.
  • For a given current the ProStop Fuse will be significantly smaller.
  • Cost Reduction Road Map: Current Designs using Ceramic Substrates can be Transitioned to Laser Drilled Larger Format Glass Substrates. MNI has Developed Strategies to Metalize Vias and Circuits as Internal Operations.
  • Scalability: The ProStop technology allows for fuses from milliamps to 100s of Amps to be made.
  • Large Current Fuses of 100A could be made using special ceramic materials and via filled connections to bottom pads that may allow for the elimination of heat sinks to significantly reduce size and cost with better performance.
  • Patent Protection for 20 years!

MNI's ProStop Fuse Advantages

The ProStop Fuse: No Encapsulant Overpack, NO END CAPS!

Traditional Solder End Cap

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No Encapsulant Required

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The ProStop Package Less Fuse can be made as small as the market can handle for assembly MNI has made the

World's smallest Fuse: 01005 size 0.4mm x 0.2mm x 0.12mm that can carry >1A.

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Lower Cost Than Competitor's Current Fuses: The smaller size of these Fuses in Flip Chip configuration on 8 inch silicon wafers allows for significant cost reduction.

Thick Film Fuse Sizes Vs MNI ProFuse Potential Cost Savings

Typical Size
MNI Size
Current
1206
0201
Up to 1.75A
1206
0603
1.75 to 8A

Both the Wire-In-Air and Solid Body Fuses can be replaced by MNI's ProStop Fuse Technology With Patent Protection.

Scalability: The ProStop technology allows for fuses from milliamps to 100s of Amps to be made

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Gap: 10um to 100um

Solder Ball Diameter: 130um to 760um

Large Current Fuses of 100A (Package Less) can be made using special ceramic materials and via filled connections to bottom pads that could potentially allow for the elimination of heat sinks to significantly reduce size and cost with better performance.

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MNI 100A Fuse

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Patent Protection for 20 years!

MNI has received two patents. A third is in process.