MNI provides reliable ESD protections such as SMDA, SMS, PSOT and SLVU families of products that meet the industry's toughest requirements. Our devices provide transient protection against ESD pulses up to 15 kV Human Body Model, and 8kV contact discharge per International Standard IEC 61000-4-2. These devices are particularly well-suited for a wide range of portable electronics (e.g. cellular phones, PDAs, notebook computers) because of their small package footprints, high ESD protection level and low loading capacitance. They are also suitable for protecting video output lines and I/O ports.

MNI delivers ESD protection devices in both package and die form. This allows system designers to meet the most stringent size, performance and cost expectations.

NEW FAMILY OF STANDARD ULTRA-LOW CAPACITANCE ESD PROTECTION DEVICES:
With 6 years of experience acquired in delivering ESD protection solutions, MNI is able to offer the utmost ultra-low capacitance solutions for a wide range of high-speed applications like general purpose high-speed data line ESD protection including USB 2.0, DVI ports, HDMI ports in note books, set top box, digital TVs, LCD Displays, ethernet 10/100, RS232/RS422, cellular phones, personal digital assistance (PDA) etc..

Part Number	Type/Function	Compatibility	Package Form	Status/Availability	Datasheet
MN0284	ESD protection for low voltage CMOS	Semtech SLVU2.8-4	8-pin DIP, 8-pin SOIC	yes	Access to MN0284
MN4220	USB 2.0	Philips IP4220	6-Pin SOT23, Wafer Form*	yes	Access to MN4220
MN4230	Unidirectional low clamping voltage TVS	On-Semi ESD9L5	2-pin DFN, Wafer Form*	Final Iteration, Dec. 08	Access to Preliminary MN4230
MN1231	2-channel ESD Clamp Protection Array	California Micro Devices CM1231	6-Pin SOT23, Wafer Form*	Under Testing, Oct. 08	Access to Preliminary MN1231
MN0402LC-V	Family of Low Capacitance TVS	Protek LC0402FC	4-Bump Flip-Chip , Wafer Form*	yes	Access to MN0402LC-V

* Minimum Quantity: 1 wafer

ORDERING INFORMATION:
Parts may be ordered with the following instructions: MN"xxxx"LC""T"-"P"-TR
"xxxx"= specific part number
"LC" for low capacitance (as opposed to standard capacitance)
"T" for temperature= "C" for commercial (0, 70°C), "I" for industrial (-20°C, +85°C)Default or no indication means "C"
"P" for packaging= "D" for DIP, "SO" for SOIC, "ST" for SOT, "DF" for DFN,"FC" for Bump Flip-Chip "WF" for wafer form
"TR" for Tape and Reel - No indication means delivery in tube

CUSTOM ESD PROTECTION DEVICES:
MNI offers custom ESD protection devices in package or wafer form.
They are built to meet customers specification and can be derived from competition's parts:
-1- If the customer is not fully satisfied with present products from the competition, MNI can adjust some parameters and make a specific product meet the specific needs
-2- If the customer double source to competition products and minimize its risk and cost
-3- If the customer needs a specific package not available from competition

SHORT TIME TO MARKET:
Typical lead time to samples 8 to 16 weeks from specification (depending upon complexity) and First delivery in 6-12 weeks after sample approval.